I am curious to know how it will be addressed by the Task groups. As a board fabricator, I have my two cents. Blind vias will be flat and cap plated only if required by customer. In that case, separate via fill step using Peters or PHP900 is taken prior to final lamination. That is the best way to ensure a flat and platable surface. If not specified, blinds vias will be filled by resin during final lamination, the surface will have a concave shape. And depends on several factors, the %of fill varies. Then it comes to Electroless copper or direct metallization. Electroless copper is very poor at covering the resin surface, thus the separation or lack of coverage of cap plating. Direct metallization does better jobs on bare resin spots but not every shop has that process. Regards, Jason Zhao -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE) Sent: Thursday, August 21, 2008 11:18 AM To: [log in to unmask] Subject: Re: [TN] Via hole fill These issues are being worked and addressed in the Task groups. I know you've had your fill of this, but it depends. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha Sent: Thursday, August 21, 2008 8:32 AM To: [log in to unmask] Subject: Re: [TN] Via hole fill Does the 6012B mention anything about blind vias that have a plated cap? When a blind via falls in an outerlayer ground plane area, it will be plated over. I've seen some cross-sections that show separation between that plated cap and the resin that filled the blind via hole. Is this covered in 6012B? Is this a defect? thanks, Eddie -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Grunde Gjertsen Sent: Wednesday, August 20, 2008 11:23 PM To: [log in to unmask] Subject: Re: [TN] Via hole fill Hi The copper thickness requirement is the same but there is a minimum fill requirement for blind and buried vias. The plating requirements is listed in 6012B table 3-2, the fill requirement is stated in 3.6.2.16, beware that for space and military avionics the requirements are tighter. br Grunde Scott Westheimer <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 19.08.2008 09:51 Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Scott Westheimer <[log in to unmask]> To [log in to unmask] cc Subject [TN] Via hole fill Can someone be so kind as to direct me to the IPC specification that covers filled via's. I am looking for the min average copper plating thickness required. These are non-conductive filled via's. Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC [log in to unmask]: (919)713-0748Cell NC: (919)961-5364 _________________________________________________________________ Get ideas on sharing photos from people like you. Find new ways to share. http://www.windowslive.com/explore/photogallery/posts?ocid=TXT_TAGLM_WL_ Phot o_Gallery_082008 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------