Does the 6012B mention anything about blind vias that have a plated cap? When a blind via falls in an outerlayer ground plane area, it will be plated over. I've seen some cross-sections that show separation between that plated cap and the resin that filled the blind via hole. Is this covered in 6012B? Is this a defect? thanks, Eddie -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Grunde Gjertsen Sent: Wednesday, August 20, 2008 11:23 PM To: [log in to unmask] Subject: Re: [TN] Via hole fill Hi The copper thickness requirement is the same but there is a minimum fill requirement for blind and buried vias. The plating requirements is listed in 6012B table 3-2, the fill requirement is stated in 3.6.2.16, beware that for space and military avionics the requirements are tighter. br Grunde Scott Westheimer <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 19.08.2008 09:51 Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Scott Westheimer <[log in to unmask]> To [log in to unmask] cc Subject [TN] Via hole fill Can someone be so kind as to direct me to the IPC specification that covers filled via's. I am looking for the min average copper plating thickness required. These are non-conductive filled via's. Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC [log in to unmask]: (919)713-0748Cell NC: (919)961-5364 _________________________________________________________________ Get ideas on sharing photos from people like you. Find new ways to share. http://www.windowslive.com/explore/photogallery/posts?ocid=TXT_TAGLM_WL_Phot o_Gallery_082008 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------