这可能与元件端或焊盘的可焊性还有回流炉的风力、风向、温度有关。试着从这些方面找找原因。

 


From: TGAsia [mailto:[log in to unmask]] On Behalf Of Roger Liu
Sent: 2008
728 9:59 AM
To: [log in to unmask]
Subject: Re: [TGA]
电容跳离电路板

 


电容贴装后位置很正,但是在通过回流炉后,电容会跳离电路板,而且离开原位置比较远比较高,哪位能指导如何是好?


Best Regards!
Roger Liu
Quality Engineer
Continental Automotive System
Office:  (086) 022-25293662
Cellular:(086) 138-2098-7845

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