Hello TechNeters, The PCB for lead free soldering with the Immersion tin technology has allegedly around 1% of Ag in this Tin plating to alleviate the whickers growth potential. Would anybody know and tell us if this 1% of Ag is the correct proportion for prevention of the whiskers growth and if not what is the recommendation? Thank you for info beforehand. Vit Sklenar . Robert Bosch (Australia) Pty.Ltd RBAU-AE/MFE3 Locked Bag 66;Clayton South, VIC 3169 AUSTRALIA Tel: +61 3 9541-7734 Fax: +61 3 9541-3909 Mob: +61 434 079 373 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------