IPC Advanced Packaging Webcast Series Selecting Components for Lead-Free SMT Assembly August 14 , 2008 - 10:00 am - 11:00 am This informative, one-hour webcast explores the impact of lead-free components, reviews several component manufacturers' specifications, and examines various compatible laminates and surface finishes for circuit boards. Assembly Process Guidelines for Wafer Level CSP August 21, 2008 - 10:00 am - 11:00 am In this one-hour webcast, participants will get a solid overview of current wafer level and die-size package technologies, plus explore common assembly process options, attachment material variations and manufacturing methodologies detailed in the new IPC-7094 document, Design and Assembly Process Implementation for Flip Chip and Die Size Components. For more information, please cut and paste http://www.ipc.org/calendar/2008/AdvancedPackagingWebcastSeries0808/AdvandcedPackagin.htm into your browser or contact Michelle Michelotti at +1 847-597-2822 or e-mail at [log in to unmask]<mailto:[log in to unmask]>. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------