Hi all, We are experiencing poor solderability with AgPd-terminations on MOVs exposed to a lead-free reflow profile using a SAC alloy on an ENIG-finished PCB. Though we have run this board only once previously with the same part finish using a lead-rich alloy, we had similar effects but not to the extent we are now experiencing. Can anyone provide some insight into this/ Regards Grant ********************************************************************** Relevant company disclaimers are available at the following addresses: Tellumat (Pty) Ltd e-mail: mailto:[log in to unmask] Web: http://www.tellumat.com/email.aspx ********************************************************************** --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------