I do agreed different chemicals react differently between them, so far the peelable that we are doing does not react with Solithane 113/113-300. Thank for the advice which is always a point to consider. ________________________________ From: TechNet on behalf of Graham Naisbitt Sent: Tue 7/1/2008 5:54 PM To: [log in to unmask] Subject: Re: [TN] Solithane coating dewetting Tan Be careful - peelable masks often contain ingredients that remain behind after removal and that can lead to unfavorable reactions. Graham Naisbitt On 27 Jun 2008, at 07:46, Tan Geok Ang wrote: > Currently, I will apply some peelable mask over those "problematic" IC > moulding, the dewetting is minimised. Just want to find out the > cause of > the problem. Thank for the advice! > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey > (EHCOE) > Sent: Thursday, 26 June 2008 10:10 PM > To: [log in to unmask] > Subject: Re: [TN] Solithane coating dewetting > > I agree with Doug, especially the part about somewhat agreeing with > Graham (just kidding). Since these are the daze of outsourcing, I have > had to give relief on the coverage requirement for non-conductive, > non-critical surface areas of plastic parts due to the aforementioned > reasons. > Dewey > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls > Sent: Thursday, June 26, 2008 5:30 AM > To: [log in to unmask] > Subject: Re: [TN] Solithane coating dewetting > > I somewhat agree with Graham. Nothing really likes to stick to > silicones, > including other silicones. I often have to address the challenge of > conformal coating delaminating over a spot where RTV silicones had > been > dripped and then wiped up. > > I would suggest plasma etching, most likely oxygen and argon. A > fairly > short duration is often effective at solving coating adhesion issues > in > problem cases. Many of the mold release agents are either teflon or > silicone based, so will be fairly chemically resistant. That is why > the > > Ensolv may not be addressing it. > > Where I disagree with Graham is the approach of having the component > manufacturer change their most release agent. If you are a Motorola > or a > > Nokia, and going through a few million components a day, you might > have > a > little leverage with the component manufacturer. Most of us just have > to > take what we can get and don't have the leverage necessary to get > changes > made. > > Doug Pauls > Rockwell Collins > > > > > Graham Naisbitt <[log in to unmask]> > Sent by: TechNet <[log in to unmask]> > 06/26/2008 06:05 AM > Please respond to > TechNet E-Mail Forum <[log in to unmask]>; Please respond to > Graham Naisbitt <[log in to unmask]> > > > To > [log in to unmask] > cc > > Subject > Re: [TN] Solithane coating dewetting > > > > > > > Silicone not sticking to silicone - no surprise. > > How to remove silicone? Not easy, maybe plasma etching or a really > aggressive solvent. > > You need to get back to the component manufacturer and have them > change their mold release or at least control how much they use. > > Graham Naisbitt > > On 26 Jun 2008, at 07:33, Tan Geok Ang wrote: > >> Hi All, >> Quite often, I encountered Solithane coating dewetting > issue >> over some IC moulding (rough or smooth, did not trace what moulding >> material is used) compounds across different suppliers, though the >> whole >> PCBAs are being cleaned with EnSolv. What is the cause of the issue? >> Is >> the cause due to the release agent used during the moulding compound >> process (but why cannot be clean away)? >> Thank in advance! >> Regards >> GA Tan >> >> --------------------------------------------------- >> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >> To unsubscribe, send a message to [log in to unmask] with following >> text in >> the BODY (NOT the subject field): SIGNOFF Technet >> To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask] >> : SET Technet NOMAIL or (MAIL) >> To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask] >> : SET Technet Digest >> Search the archives of previous posts at: > http://listserv.ipc.org/archives >> Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >> for additional information, or contact Keach Sasamori at > [log in to unmask] > >> or 847-615-7100 ext.2815 >> 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ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------