We have had a problem with some boards where the solder mask has bubbled and even come off in some places. I am looking for an ipc or other standard test method that tests for solder mask surviving soldering temperatures. The TM650 tests seem to be too low a temperature perhaps relating more to field conditions rather than soldering conditions. I have heard a test temperature of 288 deg c is used but I cant find a relevant standards based test method. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------