Hi Tan You ask if the risk is minimum - how will we know? You have a mix of chemistry that will be exposed to variations of both temperature and humidity whilst under electrical bias - ask yourself, will anyone die if the end product fails or will I lose my job? If you answer no to both of these, no problem. On the other hand, you might want to ask a few more questions to get an acceptable answer. Graham Naisbitt On 1 Jul 2008, at 16:50, Tan Geok Ang wrote: > Thanks, now I got you point. With the peelable mask applied on just > the IC moulding compound (which will be the last item to be coated), > is the risk at minimum/ should not be a issue? > Once, again thanks! > > ________________________________ > > From: Graham Naisbitt [mailto:[log in to unmask]] > Sent: Tue 7/1/2008 11:36 PM > To: Tan Geok Ang > Cc: TechNet E-Mail Forum > Subject: Re: [TN] Solithane coating dewetting > > > > Tan > > It is not a reaction with the Solithane coating that I would worry > about, it is the possibly harmful effects from the residues of the > mask on the actual circuit performance - exacerbated by the presence > of a hydrophilic coating. > > Graham Naisbitt > > On 1 Jul 2008, at 13:02, Tan Geok Ang wrote: > >> I do agreed different chemicals react differently between them, so >> far the peelable that we are doing does not react with Solithane >> 113/113-300. Thank for the advice which is always a point to >> consider. >> >> ________________________________ >> >> From: TechNet on behalf of Graham Naisbitt >> Sent: Tue 7/1/2008 5:54 PM >> To: [log in to unmask] >> Subject: Re: [TN] Solithane coating dewetting >> >> >> >> Tan >> >> Be careful - peelable masks often contain ingredients that remain >> behind after removal and that can lead to unfavorable reactions. >> >> Graham Naisbitt >> >> >> On 27 Jun 2008, at 07:46, Tan Geok Ang wrote: >> >>> Currently, I will apply some peelable mask over those "problematic" >>> IC >>> moulding, the dewetting is minimised. Just want to find out the >>> cause of >>> the problem. Thank for the advice! >>> >>> -----Original Message----- >>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey >>> (EHCOE) >>> Sent: Thursday, 26 June 2008 10:10 PM >>> To: [log in to unmask] >>> Subject: Re: [TN] Solithane coating dewetting >>> >>> I agree with Doug, especially the part about somewhat agreeing with >>> Graham (just kidding). Since these are the daze of outsourcing, I >>> have >>> had to give relief on the coverage requirement for non-conductive, >>> non-critical surface areas of plastic parts due to the >>> aforementioned >>> reasons. >>> Dewey >>> >>> -----Original Message----- >>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls >>> Sent: Thursday, June 26, 2008 5:30 AM >>> To: [log in to unmask] >>> Subject: Re: [TN] Solithane coating dewetting >>> >>> I somewhat agree with Graham. Nothing really likes to stick to >>> silicones, >>> including other silicones. I often have to address the challenge of >>> conformal coating delaminating over a spot where RTV silicones had >>> been >>> dripped and then wiped up. >>> >>> I would suggest plasma etching, most likely oxygen and argon. A >>> fairly >>> short duration is often effective at solving coating adhesion issues >>> in >>> problem cases. Many of the mold release agents are either teflon >>> or >>> silicone based, so will be fairly chemically resistant. That is why >>> the >>> >>> Ensolv may not be addressing it. >>> >>> Where I disagree with Graham is the approach of having the component >>> manufacturer change their most release agent. If you are a Motorola >>> or a >>> >>> Nokia, and going through a few million components a day, you might >>> have >>> a >>> little leverage with the component manufacturer. Most of us just >>> have >>> to >>> take what we can get and don't have the leverage necessary to get >>> changes >>> made. >>> >>> Doug Pauls >>> Rockwell Collins >>> >>> >>> >>> >>> Graham Naisbitt <[log in to unmask]> >>> Sent by: TechNet <[log in to unmask]> >>> 06/26/2008 06:05 AM >>> Please respond to >>> TechNet E-Mail Forum <[log in to unmask]>; Please respond to >>> Graham Naisbitt <[log in to unmask]> >>> >>> >>> To >>> [log in to unmask] >>> cc >>> >>> Subject >>> Re: [TN] Solithane coating dewetting >>> >>> >>> >>> >>> >>> >>> Silicone not sticking to silicone - no surprise. >>> >>> How to remove silicone? Not easy, maybe plasma etching or a really >>> aggressive solvent. >>> >>> You need to get back to the component manufacturer and have them >>> change their mold release or at least control how much they use. >>> >>> Graham Naisbitt >>> >>> On 26 Jun 2008, at 07:33, Tan Geok Ang wrote: >>> >>>> Hi All, >>>> Quite often, I encountered Solithane coating dewetting >>> issue >>>> over some IC moulding (rough or smooth, did not trace what moulding >>>> material is used) compounds across different suppliers, though the >>>> whole >>>> PCBAs are being cleaned with EnSolv. What is the cause of the >>>> issue? >>>> Is >>>> the cause due to the release agent used during the moulding >>>> compound >>>> process (but why cannot be clean away)? >>>> Thank in advance! >>>> Regards >>>> GA Tan >>>> >>>> --------------------------------------------------- >>>> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >>>> To unsubscribe, send a message to [log in to unmask] with following >>>> text in >>>> the BODY (NOT the subject field): SIGNOFF Technet >>>> To temporarily halt or (re-start) delivery of Technet send e-mail >>>> to >>> [log in to unmask] >>>> : SET Technet NOMAIL or (MAIL) >>>> To receive ONE mailing per day of all the posts: send e-mail to >>> [log in to unmask] >>>> : SET Technet Digest >>>> Search the archives of previous posts at: >>> http://listserv.ipc.org/archives >>>> Please visit IPC web site >>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >>>> for additional information, or contact Keach Sasamori at >>> [log in to unmask] >>> >>>> or 847-615-7100 ext.2815 >>>> ----------------------------------------------------- >>> >>> --------------------------------------------------- >>> Technet Mail List provided as a service by IPC using LISTSERV 15.0 >>> To unsubscribe, send a message to [log in to unmask] with following >>> text >>> in >>> the BODY (NOT the subject field): SIGNOFF Technet >>> To temporarily halt or (re-start) delivery of Technet send e-mail to >>> [log in to unmask]: SET Technet NOMAIL or (MAIL) >>> To receive ONE mailing per day of all the posts: send e-mail to >>> [log in to unmask]: SET Technet Digest >>> Search the archives of previous posts at: >>> http://listserv.ipc.org/archives >>> Please visit IPC web site >>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >>> for additional information, or contact Keach Sasamori at >>> [log in to unmask] >>> or >>> 847-615-7100 ext.2815 >>> ----------------------------------------------------- >>> >>> >>> 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