Hi Paul Can you elaborate? What is failing and why? What is then the failure rate for lead-free? The same? Lower? Higher? ... I guess I should read the papers ;-) I am interested in getting copies if you have a spare set... :-) Maybe Steve would be so kind as to consent to post them to save you a lot of bother should many others have similar interest Thanks in advance, Joe In a message dated 7/31/2008 6:29:39 A.M. Pacific Daylight Time, [log in to unmask] writes: My sense is that 30% of the reliability failures, in a tin-lead application, are due to PCB failures. **************Get fantasy football with free live scoring. Sign up for FanHouse Fantasy Football today. (http://www.fanhouse.com/fantasyaffair?ncid=aolspr00050000000020) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------