Hi Paul
 
Can you elaborate? What is failing and why? What is then the failure rate  
for lead-free?  The same? Lower? Higher? ... I guess I should read the  papers 
;-) 
 
I am interested in getting copies if you have a spare set... :-)  
 
Maybe Steve would be so kind as to consent to post them to save you a lot  of 
bother should many others have similar interest
 
Thanks in advance, 
Joe 
 
 
In a message dated 7/31/2008 6:29:39 A.M. Pacific Daylight Time,  
[log in to unmask] writes:

My sense  is that 30% of the reliability failures, in a tin-lead
application, are due  to PCB failures.




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