Technetters, We are having an issue with solder fines on our lead free boards. We are using SAC305 WS and no nitrogen. I noticed that our boards have craters in the paste on the pads after being printed. Not all pads are deposited this way, but maybe 25%. These craters have an air bubble in them. The bubbles usually burst before the boards goes into the P&P, but the crater stays. The screening process is exactly the same for leaded and unleaded paste. The leaded paste does not behave this way. Could these craters be a symptom of the cause of the solder fines? Anyone have any experience with this? How do I go about posting pictures to stevezeva.homestead.com?. -- Leif Erik Laerum Quality Assurance Manager Texas Memory Systems [log in to unmask] Tel: (713) 266-3200 x468 www.texmemsys.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------