Hi Grant! Components which use either a AgPd or a AgPdPt termination finish can be problematic at times. Both of these termination finishes tend to have short shelf lives in terms of solderability. It is not uncommon to only have a 3-6 month solderability shelf life - in comparison to many component finishes which have a 12 month solderability shelf life. Also, many of the components with a AgPd or a AgPdPt termination finish have a solder-ability concern of leaching the termination finish off the component resulting in a loss of solder joint integrity. I wouldn't necessarily say that the a AgPd or a AgPdPt termination finishes are not compatible with a Pbfree soldering process but the higher process temperatures of SAC soldering processes is going to accelerate the leaching of the termination finish so you will have a significantly reduced process window in comparison to a tin/lead process. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] Grant Emandien <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 07/02/2008 04:19 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Grant Emandien <[log in to unmask]> To [log in to unmask] cc Subject [TN] Silver-Palladium termination SMT solder problems Hi all, We are experiencing poor solderability with AgPd-terminations on MOVs exposed to a lead-free reflow profile using a SAC alloy on an ENIG-finished PCB. Though we have run this board only once previously with the same part finish using a lead-rich alloy, we had similar effects but not to the extent we are now experiencing. Can anyone provide some insight into this/ Regards Grant ********************************************************************** Relevant company disclaimers are available at the following addresses: Tellumat (Pty) Ltd e-mail: mailto:[log in to unmask] Web: http://www.tellumat.com/email.aspx ********************************************************************** --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------