July 23, 2008

J-STD-001 is silent on how long a time span is acceptable between wave or 
reflow soldering and post cleaning for instances where cleaning is mandated 
because organic Type M or H flux was used.

I believe the historical soldering specs MIL-STD-2000 and MIl-STD-454 
requirement 5 mandated no more than one hour between cleaning and 
solddering.

Is there a technically necessary maximum limit and if so is there data to 
support it?  If there is a technical supported limit why should we mandate 
it in J-STD-001?

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