Overcoming the Reliability Challenge: An IPC
The Reliability Challenge was a two-day summit in April 2008
dedicated to the changing world of reliability in electronic modules, boards,
assemblies and systems. Conference paper presentations are included in this
proceedings as follows: Reliability Challenges and Solutions, an OEM
perspective by Intel, Sun Microsystems, and Cisco Systems, Jupiter Networks,
Lockheed Martin, Raytheon Company and Phillips Healthcare; Meeting the
Customer's Reliability Expectations by Celestica International, Intel, FTG
Circuits and Colonial Circuits; A Company's Experience with Reliability
Programs: Case Studies, Endicott Interconnect Technologies, Conductor Analysis
Technologies, and FTG Circuits; How to Establish Models for Reliability,
Engelmaier Associates; Thermal Cycle Testing of Boards, Integrated Reliability
Test Systems, and PWB Interconnect Solutions; Drop Testing, Japan Electronics
Packaging and Circuits Association; Combined Environment Testing, Microtek
Laboratories; Reliability Validation Through Accelerated Testing, Engelmaier
Associates and Current Reliability Over Projects, SAIC. Released July 2008.
CD:
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