All:

We got a complaint from customer---DIMM slot golden finger have flux contamination (the contamination can be seen after DIMM insertion, but can not be seen if no insertion), customer concerned that the contamination will affect boards reliability (but we did not find any failure due to this contamination), and from our investigation, the flux is from wave soldering process(it＊s not hike up from top side, but drill through bottom side, it＊s unavoidable due to DIMM&PTH design), and flux type is LF no-clean,

so I＊d like to know which spec defined above situation? Is it acceptable?

 

 

 

 

Regards

WB

 


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