随着高科技的日新月异,越来越多的通用标准已经过时,已经不能满足当前的需要,,当前的业界的标准不能与时俱进,这是一个大家都关注的问题.但没有共鸣
赵艳提出的这个问题只是反映了其中的一种现象.


Regards.
FP Deng
Manufacturing Engineering
Tel: +86-0769-83394581-260 email:[log in to unmask]
www.celestica.com
 
Solid Partners. Flexible Solutions.
 


周利文 <[log in to unmask]>

2008-06-19 10:22

To
"'Asia Committe Task Group Forum'" <[log in to unmask]>, "'FP Deng'" <[log in to unmask]>
cc
Subject
答复: [TGA] 答复: Re: [TGA] 有关激光分板的可靠性问题





 
针对激光分板机,我去年有评估过,存在板边碳化现象。
后来,我再找了一家,用带5轴步过马达驱动机械平台,再装上高速铣刀,可以实现。
但效率有点低,外观很漂亮。
以上,请参考。
谢谢!!
 
 
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发件人: TGAsia [mailto:[log in to unmask]] 代表 FP Deng
发送时间:
2008年6月18日 17:20
收件人:
[log in to unmask]
主题:
Re: [TGA] 答复: Re: [TGA] 有关激光分板的可靠性问题



最近几年出来的此类设备,速度相对比原来增加了许多,当然,如果想用此类设备,当然应该考虑它的生产能力,是否经济,灵活,实用和它对产品的影响.


现在已经有许多公司用激光切割机分板,因其外观质量是可控制的.  这可能是个趋势吧. FYI



Regards.

FP Deng

Manufacturing Engineering
Tel: +86-0769-83394581-260 email:[log in to unmask]

www.celestica.com
 
Solid Partners. Flexible Solutions.

 

[log in to unmask]

2008-06-18 16:49


To
Asia Committe Task Group Forum <[log in to unmask]>, FP Deng <[log in to unmask]>
cc
[log in to unmask]
Subject
答复: Re: [TGA] 有关激光分板的可靠性问题








前年实验过,有两个问题,FYI:

1、分板效率低(前年的制程水平如此,不知现在效率如何)

2、外观有问题,不如铣板和V-CUT美观。

Best Regards,

Charlie Zhao (Ying Jun Zhao)

******************************************
Emerson Network Power C0.,Ltd
Pilot Electronic Technology Dept.
No.1 Kefa Road,Science & industry Park
Nanshan District,518057
Shenzhen,China

Tel:86-0755-86010808   86011282(Direct)    
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FP Deng <[log in to unmask]>
发件人: TGAsia <[log in to unmask]>

2008-06-18 15:52
请答复 给 Asia Committe Task Group Forum; 请答复 给 FP Deng

       
      收件人:        [log in to unmask]

      抄送:        

      主题:        Re: [TGA] 有关激光分板的可靠性问题






这是个很好的LEAN project,用激光切割机分板还是切实可行的,它的影响只是外观问题,最重要的的是能够说服你的客户并能够接受........





Regards.

FP Deng

Manufacturing Engineering
Tel: +86-0769-83394581-260 email:[log in to unmask]

www.celestica.com


Solid Partners. Flexible Solutions.

Renie Zhao <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]>

2008-06-18 15:37
Please respond to
Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
Renie Zhao <[log in to unmask]>


To [log in to unmask]
cc
Subject Re: [TGA] 有关激光分板的可靠性问题











我们现在用的都是Router 或者使Punching, 但发现夹具成本费非常高,如果用激光自动切割的话,可以省掉不同产品的夹具成本, 也可以提高激光机的应用灵活性。


Best regards

Renie Zhao (赵艳)

Phone: +86-13543085801

Email:
[log in to unmask]









From:
NG ENG GUAN [mailto:[log in to unmask]]
Sent:
Wednesday, June 18, 2008 3:27 PM
To:
'Asia Committe Task Group Forum'; Renie Zhao
Subject:
RE: [TGA]
有关激光分板的可靠性问题

赵艳小姐,


你好. 我觉的因该不行. 关键是,有必要用激光切割机进行分板吗?





From:
TGAsia [mailto:[log in to unmask]] On Behalf Of Renie Zhao
Sent:
18 June 2008 15:18
To:
[log in to unmask]
Subject:
[TGA]
有关激光分板的可靠性问题

Dear All:
为了提高PCBA 的分板效率,我们试图用激光切割机进行分板,但是在分板过程中总是有碳化现象, 我们也进行了可靠性测试(功能,跌落,温湿循环,热冲击, 功能),发现即使有轻微碳化现象,也不影响PCBA 的性能。有关此事请教大家下面几个问题:

1.         在IPC 的标准中,用激光进行PCBA的分割,是否允许有轻微碳化现象?
2.         如果不允许,在我们进行了一系列的可靠性 测试之后,如果确认轻微碳化并不影响其性能,那么有没有可能根据实际更改一下IPC 的标准?


Best regards

Renie Zhao (
赵艳)
Phone: +86-13543085801

Email:
[log in to unmask]









From:
TGAsia [mailto:[log in to unmask]] On Behalf Of Leo Zhang
Sent:
Tuesday, June 17, 2008 10:52 AM
To:
[log in to unmask]
Subject:
[TGA]
交流(镀金)


Dear ALL

请问哪位对镀金(工艺/工序)比较了解,我有一些问题想请教和交流一下,谢谢!

Best Regards
Leo Zhang  
张毅博
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SZ Kaifa Mirco Electronics Co., Ltd.
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