I agree with Doug, especially the part about somewhat agreeing with Graham (just kidding). Since these are the daze of outsourcing, I have had to give relief on the coverage requirement for non-conductive, non-critical surface areas of plastic parts due to the aforementioned reasons. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls Sent: Thursday, June 26, 2008 5:30 AM To: [log in to unmask] Subject: Re: [TN] Solithane coating dewetting I somewhat agree with Graham. Nothing really likes to stick to silicones, including other silicones. I often have to address the challenge of conformal coating delaminating over a spot where RTV silicones had been dripped and then wiped up. I would suggest plasma etching, most likely oxygen and argon. A fairly short duration is often effective at solving coating adhesion issues in problem cases. Many of the mold release agents are either teflon or silicone based, so will be fairly chemically resistant. That is why the Ensolv may not be addressing it. Where I disagree with Graham is the approach of having the component manufacturer change their most release agent. If you are a Motorola or a Nokia, and going through a few million components a day, you might have a little leverage with the component manufacturer. Most of us just have to take what we can get and don't have the leverage necessary to get changes made. Doug Pauls Rockwell Collins Graham Naisbitt <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 06/26/2008 06:05 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Graham Naisbitt <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Solithane coating dewetting Silicone not sticking to silicone - no surprise. How to remove silicone? Not easy, maybe plasma etching or a really aggressive solvent. You need to get back to the component manufacturer and have them change their mold release or at least control how much they use. Graham Naisbitt On 26 Jun 2008, at 07:33, Tan Geok Ang wrote: > Hi All, > Quite often, I encountered Solithane coating dewetting issue > over some IC moulding (rough or smooth, did not trace what moulding > material is used) compounds across different suppliers, though the > whole > PCBAs are being cleaned with EnSolv. What is the cause of the issue? > Is > the cause due to the release agent used during the moulding compound > process (but why cannot be clean away)? > Thank in advance! > Regards > GA Tan > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask] > : SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask] > : SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] > or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------