Yes, there is at least one issue: we have observed massive tombstoning happening with these components when soldered with SnPb. My explanation for the high tombstoning level: SAC plating melts above SnPb melting temperature in the sharp rise to peak temperature leading to a sudden change in wetting behavior of the component leads. As a result, an imbalance in temperature/timing between both passive's ends gives a high probability of tombstoning. Geert Willems IMEC --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------