Kenny You might have to thin your viscosity if spray application Luis Gallegos -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Bloomquist Sent: Monday, June 02, 2008 11:58 AM To: [log in to unmask] Subject: Re: [TN] Tiny Bubbles Woops, I forgot to mention that we spray coat these boards. The bubbles are most prevalent along thick edges but pretty much everywhere. I'll see if I can get Steve to post a picture. Thanks, KennyB -----Original Message----- From: Kathy Kuhlow [mailto:[log in to unmask]] Sent: Monday, June 02, 2008 9:53 AM To: 'TechNet E-Mail Forum'; Ken Bloomquist Subject: RE: [TN] Tiny Bubbles Are the air bubbles along component edges or open areas? It might be that you are moving the board in/out of the material too fast. I know from a past project we needed to allow extra time during the dip prior to removal for the air bubble to release on SOT package devices. Kat --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- CONFIDENTIALITY This e-mail message and any attachments thereto, is intended only for use by the addressee(s) named herein and may contain legally privileged and/or confidential information. If you are not the intended recipient of this e-mail message, you are hereby notified that any dissemination, distribution or copying of this e-mail message, and any attachments thereto, is strictly prohibited. If you have received this e-mail message in error, please immediately notify the sender and permanently delete the original and any copies of this email and any prints thereof. ABSENT AN EXPRESS STATEMENT TO THE CONTRARY HEREINABOVE, THIS E-MAIL IS NOT INTENDED AS A SUBSTITUTE FOR A WRITING. Notwithstanding the Uniform Electronic Transactions Act or the applicability of any other law of similar substance and effect, absent an express statement to the contrary hereinabove, this e-mail message its contents, and any attachments hereto are not intended to represent an offer or acceptance to enter into a contract and are not otherwise intended to bind the sender, Sanmina-SCI Corporation (or any of its subsidiaries), or any other person or entity. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------