Specification for Embedded Passive Device Resistor Materials
for Rigid and Multilayer Printed Boards
This document describes materials that
can be used for the fabrication of embedded passive resistor devices within the
finished printed circuit board substrate. It provides information on general
designations and associated characteristics of embedded passive device (EPD)
resistor materials. The document shall be used as a qualification and
conformance standard for designers and users when designing or constructing
printed circuit boards containing these EPD materials. This document contains
material designation, conformance (requirements), qualification
(characterization) and quality assurance specifications. This document should
be used in conjunction with both the IPC-2000 series design and the IPC-6010
series qualification and performance standards. 26 pages. Released April 2008.
Qualification and Performance Specification of Permanent,
Semi-Permanent and Temporary Legend and/or Marking Ink
The
industry's first specification for the evaluation of a legend and/or marking
ink material for the determination of acceptability of use in a standard
printed board system. IPC-4781 provides coverage for adhesion, material
qualification and testing, resistances to solvents, requirements for resistance
to lead-free solders, and electrical requirements. 17 pages. Released May 2008.
Metal Foil for Printed Board Applications
This
specification covers metal foils supported by carrier films and unsupported
foils suitable for subsequent use in only printed boards and addresses the
requirements for procurement of these same metal foils. Unless otherwise agreed
upon between user and supplier (AABUS), metal foils shall be considered
acceptable as long as the requirements in this specification are met. 27 pages.
Released April 2008.
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