The reference that you're looking for is in IPC-7711 method 5.3.1. This is the only method in 7711 that is cited for manual chip installation. This method describes the use of solder paste and hot air to install a chip device. The removal methods, 3.3.1 - 3.3.3, are bifurcated tip, thermal tweezers and hot air. Other methods are acceptable as long as the other requirements (ility's) are met in addition to workmanship. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Wednesday, April 30, 2008 4:54 PM To: [log in to unmask] Subject: [TN] Rework/touchup of MLCCC chip capacitors and ceramic chip resistors Werner's mentioning of pad design to prevent chip cracking and other issues discussed recently had me wondering if hot air rework, whether done by hot-gas rework machines or by using hand-held hot air stations such as the Hakko, is required for Class 3 hardware. I thought it was, but cannot find a reference to it in J-STD-001D, -DS, or in the Handbook. Therefore I am under the assumption that rework of ceramic chip caps/resistors using standard solder irons is acceptable, even if not preferred. Is this true? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------