Ioan, There are now new chemicals used for VP soldering and this, plus the resurgent interest in a uniform heating technology (especially for lead-free solders) has spurred new interest in the process. We use VP for a number of applications and it works well for us. In fact, very well. I have attached information on a seminar for anyone interested in learning more about this technology. I saw a VP REWORK station at APEX that we are looking into also. Please note the comments in the abstract below about the new fluids now available. Upper Mid-west Chapter of SMTA is sponsoring a Vapor Phase Reflow discussion. If you are interested in Vapor Phase Reflow and how it helps eliminate gradient heating across the SMT assembly, then this seminar is a must see. Please RSVP at the bottom of this e-mail. The topic of this seminar is "Application of Vapor Phase Technology". Gradient temperature across a circuit board in reflow is not a new factor for manufacturing using convection ovens but is more significant with the introduction of lead-free processing when it comes to max temperatures of components. We have 2 speakers on tap for this discussion and they are: David Suihkonen R&D Technical Services, Inc Anthony Primavera, PhD Boston Scientific Date: Tuesday, May 20th, 2008 Cost: $20 Members / $30 Non-members Special Bring a Non-member promo: All non-members that become members for this event are automatically in the drawing for an IPOD and get the reduced rate for attendance with this event. Another drawing for a second IPOD is for the existing members that attend. Location: Hennepin Technical College, Eden Praire Campus RSVP: Click link at bottom of e-mail. Time/Agenda: * 1:30 to 2:00 PM - Registration * 2:00 to 2:45 PM - David * 3:00 to 3:45 PM - Anthony Address/Directions to Hennepin Technical College: Eden Prairie Campus 13100 College View Drive Eden Prairie, MN 55347 From 494 South: Exit from 494 at Valley View Road. At the top of the ramp, go left. Follow Valley View Road to Highway 212 West. Proceed south on Highway 212 West approximately 2.5 miles. Turn right at College View Drive proceed to Eden Prairie Campus. Building J From 494 West: Exit from 494 at Highway 212 west. Proceed south on Highway 212 west approximately 2 miles. Turn right at College View Drive proceed to Eden Prairie Campus. Building J Abstract: Complex, multilayer and heavy back plane circuit boards have been soldered using condensing vapor reflow technology for many years. However, Vapor Phase is finding new life in many applications where thermal uniformity, control of peak reflow temperatures, and lower peak temperatures for lead free soldering are required. In-line reflow soldering is currently dominated by convection furnaces as they provide good thermal process capabilities at a reasonable price, and high through put. One disadvantage, however, is that a temperature gradient occurs between small and large devices, area array components, components with a high thermal mass, and for many other reasons. As the high reliability industry is moving towards lead free soldering, and the drive to have better process controls in many applications, the need to reduce the temperature gradient across a product increases. As in many things, what's old is new again. Vapor phase soldering, which was a soldering standard process for many years, fell out of favor due to higher cost, the use of Freon and other CFC based chemistry, and batch processing. Vapor phase soldering, however, is being examined closely by many industries today, as an alternative to convection reflow for high reliability applications, such as medical electronics, military, avionics, high end telecommunication and automotive. In part, many of the technology detractors, have been overcome or eliminated. Several companies are now offering commercially available, in-line fully contained vapor reflow systems. Additionally, CFC based chemistry has been replaced by PFPE based inert fluids produced by 3M, Dupont, and Galden. The new systems are now designed such that the reflow vapor is self contained inside a sealed chamber, and all systems recover a substantial portion of the vapor into condensed fluid. The main advantage of vapor phase reflow is the uniformity of temperature across the entire assembly. As the fluid condenses on the surface of the PCB and components, the latent heat of condensation gives off all the reaction energy to heating the surfaces. This phase change occurs at the specific temperature of the fluid's boiling point. Temperature gradients of under 5 degrees are common with 1 degree possible. Vapor phase reflow technology, and the advantages are discussed in these presentations. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea Sent: Monday, May 12, 2008 8:24 AM To: [log in to unmask] Subject: [TN] Vapor phase Dear Technos, I would like to get your expert opinion on the latest developments in the vapour phase technology. The last time this topic has been discussed here this was still an environmental hazard. Here's the latest sales pitch: Dear Convection Oven Users: With Energy Costs Skyrocketing, You have a cheaper, efficient, and a better yield Alternative!! Low Operating Cost, 110 Volt Machine, Run Lead and Lead Free Sequentially!! High Yield, Run your Lead Free Boards at 230 Degrees Uniform Temperature Distribution, No Circuit Board Delamination, Uses Environmentally Friendly Teflon 2 Liquid No Hazardous Florocarbons! The questions are: * Are the advantages real, should I prefer vapour phase over convection in day by day reflow operations, from the technical point of view? * Would the technology finally be environmentally friendly? Thanks, Ioan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------