Dan, Being a consultant on a military electronics team, I can say the BGA performance very much depends on the board layout, component location, method of locking the board in a card frame, use of board stiffeners, solder used, circuit board material used (read that Tg 130C or Tg170C epoxy), and a host of other factors. Vibration analysis is pretty complex and certain consultants have set up specialties in the subject. Also, I am of the opinion that most military contractors have developed good design models for vibration environments, even though they do not publish much on the subject. One good place to start to understand vibration on board reliability is the JCAA-JGPP project subjecting over 150 identical boards to a variety of thermal cycle, vibration, drop shock, and combined environment stresses. The web site to that report is _http://acqp2.nasa.gov/projects/LeadFreeSolderTestingForHighReliability_Proj1. html_ (http://acqp2.nasa.gov/projects/LeadFreeSolderTestingForHighReliability_Proj1.html) and in particular the vibration section written by Tom Woodrow of Boeing: _http://acqp2.nasa.gov/LFS%20Reliability/VibEMP%20Rev.%20A%20010906.pdf_ (http://acqp2.nasa.gov/LFS%20Reliability/VibEMP%20Rev.%20A%20010906.pdf) Please contact me offline if you need the names of some consulting organizations who can help you in your vibration analyses. Denny Fritz SAIC, Inc. ********************************* In a message dated 5/8/2008 10:06:34 A.M. Eastern Daylight Time, [log in to unmask] writes: I have received an inquiry from a customer regarding deflection data. They want to know if there's any data they can input so they can simulate if their BGAs will be ejected off their PCBs in a high vibe environment. The PCB is a 14 layer FR-4 .062 thick. Any guidance would be greatly appreciated. **************Wondering what's for Dinner Tonight? Get new twists on family favorites at AOL Food. (http://food.aol.com/dinner-tonight?NCID=aolfod00030000000001) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------