Hi Charles,

 

I think assemblied boards should follow IPC-A-610D 10.2.7.

 

BR

Rick

  _____  

From: TGAsia [mailto:[log in to unmask]] On Behalf Of charles.lee
Sent: Friday, April 11, 2008 1:19 PM
To: [log in to unmask]
Subject: [TGA] 答复: [TGA] Bow and Twist standard after Reflow/Wave oven

 

Dear Choi,

 

Thanks for your kind reply. 

 

Per my understanding, below standard is aimed at PCB board  flatness--->Bare board,without components on it  

But we would like to know PWA flatness standard after reflow /wave soder ??--->PCB With Assembly, PCB with SMD components or other parts

 

Best regards

Charles Lee

 

  _____  

发件人: 최천형 [mailto:[log in to unmask]] 
发送时间: 2008年4月11日 12:57
收件人: Asia Committe Task Group Forum; charles.lee
主题: Re: [TGA] Bow and Twist standard after Reflow/Wave oven

 

For SMD the bow and twist shall be 0.75% or less. Another PCB they shall be 1.50% or less.

 

For more details please find IPC_A_600  2.11.

 

Choi

----- Original Message ----- 

From: charles.lee <mailto:[log in to unmask]>  

To: [log in to unmask] 

Sent: Friday, April 11, 2008 1:20 PM

Subject: [TGA] Bow and Twist standard after Reflow/Wave oven

 

Dear All,

 

Do you have PWA bow and twist  standard afetr reflow/wave solder ? Our customer is really concerned PCB flatness after assembly .

 

Thanks in advance.

 

Best regards

Charles Lee @ SVA DD&TT