Is there someone who wants to answer my questions? Best regards. ----- Original Message ----- From: SAHLI habib To: [log in to unmask] Sent: Thursday, March 20, 2008 1:01 PM Subject: Various questions Dear Technetters, Can I have the privelege to get brief answers to all my following questions : 1- Main copper thickness used in Automotive market? 2- Does Automotive market is asking for copper thickness reduction? 3- What is the standard maximum and minimum bow and twist for Pcbs with BGA components? 4- What is the standard tolerance for press-fit PTH? 5- When is panel plating suggested and When is pattern plating suggested? 6- What is the standard value for annular ring for Pcbs with high copper thicknes (more than 3 oz)? 7- Is AOI detecting all the PCB defects? What defects are not detected? 8- Is the automotive market requesting 100% AOI in internal and external layers? 9- What the is the maximum offset between copper and solder mask requested in the automotive market? 10- What the is the maximum offset between copper,solder mask and holes requested in the automotive market? 11- What is the main surface finish for Automotive? 12- What product application is used OSP for? 13- What product application is used ENIG for? 14- What product application is used Immersion Silver for? 15- Is Screen printing in use for Automotive market? 16- Is Screen printing used to mark code matrix? 17- What is the maximum accepted value of Ionic contamination in Automotive market. (µg Na Cl/square for inch) 18- Are customers requesting Ioni chromatography or any other similar analysis? 19- Is the automotive market requesting PEA packaging (Electrostatic Protected Area)? 20- Is Pollution gas test required for Automotive market? 21- What are the Significant Characteristics defined by Automotive market? 22- What are the main characteristics for satndard FR4 base material? 23- What are the main characteristics for lead free base material? Thank you in advance for your support. Habib --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------