Darn straight answers, Graham. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt Sent: Wednesday, April 02, 2008 1:19 AM To: [log in to unmask] Subject: Re: [TN] Various questions Habib As Dr Christian has already pointed out, you ask too much - you should attend our meetings to get a better understanding of the issues you raise. However, trying to be helpful, let me answer you briefly on each your questions: On 1 Apr 2008, at 15:14, SAHLI habib wrote: > Is there someone who wants to answer my questions? > > Best regards. > ----- Original Message ----- > From: SAHLI habib > To: [log in to unmask] > Sent: Thursday, March 20, 2008 1:01 PM > Subject: Various questions > > > Dear Technetters, > > Can I have the privelege to get brief answers to all my following > questions : > > 1- Main copper thickness used in Automotive market? As thin as possible > > 2- Does Automotive market is asking for copper thickness reduction? Yes. > > 3- What is the standard maximum and minimum bow and twist for Pcbs > with BGA components? Very little. > > 4- What is the standard tolerance for press-fit PTH? Small. > > 5- When is panel plating suggested and When is pattern plating > suggested? Refer to standards. > > 6- What is the standard value for annular ring for Pcbs with high > copper thicknes (more than 3 oz)? Refer to standards. > > 7- Is AOI detecting all the PCB defects? No. > What defects are not detected? Those that are not detectable by AOI method > > 8- Is the automotive market requesting 100% AOI in internal and > external layers? Maybe. > > 9- What the is the maximum offset between copper and solder mask > requested in the automotive market? Refer to standards. > > 10- What the is the maximum offset between copper,solder mask and > holes requested in the automotive market? Refer to standards. > > 11- What is the main surface finish for Automotive? OSP - ENIG - HASL - ImSn - it depends on the application. > > 12- What product application is used OSP for? It depends > > 13- What product application is used ENIG for? It depends > > 14- What product application is used Immersion Silver for? It depends > > 15- Is Screen printing in use for Automotive market? Probably > > 16- Is Screen printing used to mark code matrix? Sometimes > > 17- What is the maximum accepted value of Ionic contamination in > Automotive market. (µg Na Cl/square for inch) Often <0.2mg/cm2 NaCl equivalence > > 18- Are customers requesting Ioni chromatography or any other similar > analysis? Yes. > > 19- Is the automotive market requesting PEA packaging (Electrostatic > Protected Area)? Usually. > > 20- Is Pollution gas test required for Automotive market? Yes but not always. > > 21- What are the Significant Characteristics defined by Automotive > market? High reliability. > > 22- What are the main characteristics for satndard FR4 base material? Flame retardance. > > 23- What are the main characteristics for lead free base material? ? > > > Thank you in advance for your support. > > Habib > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 To > unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt > or (re-start) delivery of Technet send e-mail to [log in to unmask] > : SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask] > : SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at > [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------