Werner's mentioning of pad design to prevent chip cracking and other
issues discussed recently had me wondering if hot air rework, whether
done by hot-gas rework machines or by using hand-held hot air stations
such as the Hakko, is required for Class 3 hardware. I thought it was,
but cannot find a reference to it in J-STD-001D, -DS, or in the
Handbook. Therefore I am under the assumption that rework of ceramic
chip caps/resistors using standard solder irons is acceptable, even if
not preferred. Is this true?

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