Werner's mentioning of pad design to prevent chip cracking and other issues discussed recently had me wondering if hot air rework, whether done by hot-gas rework machines or by using hand-held hot air stations such as the Hakko, is required for Class 3 hardware. I thought it was, but cannot find a reference to it in J-STD-001D, -DS, or in the Handbook. Therefore I am under the assumption that rework of ceramic chip caps/resistors using standard solder irons is acceptable, even if not preferred. Is this true? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------