TechTeam,

We are in the very beginning stages of starting a conversion from one hand 
cleaning solvent to another more effective one. I am curious what makes the 
most sense in terms of methods to use to qualify as well as what is the likely 
norm from the industry? We are required to perform SIR or ECM, and IC testing 
by various customers prior to any changes which I think is a good thing, but 
what would be the application process of flux, soldering, and finally cleaning? 
As well as the actual soldering and cleaning process. With the various 
geometries, spacing, ground planes, thermal requirements, materials, time, 
etc... How would best capture the effectiveness of the new solvent? We are 
currently using an RMA 15% solid flux, hand soldering with 600-700dgree tips 
on multi-layer product from FR4 to teflon. I hope I didn't open a huge can-o-
worms.

Thanks all and have a great day!

Chris

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