TechTeam, We are in the very beginning stages of starting a conversion from one hand cleaning solvent to another more effective one. I am curious what makes the most sense in terms of methods to use to qualify as well as what is the likely norm from the industry? We are required to perform SIR or ECM, and IC testing by various customers prior to any changes which I think is a good thing, but what would be the application process of flux, soldering, and finally cleaning? As well as the actual soldering and cleaning process. With the various geometries, spacing, ground planes, thermal requirements, materials, time, etc... How would best capture the effectiveness of the new solvent? We are currently using an RMA 15% solid flux, hand soldering with 600-700dgree tips on multi-layer product from FR4 to teflon. I hope I didn't open a huge can-o- worms. Thanks all and have a great day! Chris --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------