Recently a customer asked the following question. Here is his question. I do have a question of interpretation for you regarding "gold removal". In section 3.9.3 it states that ".....95% of the surface to be solder ....." needs to have gold removed. Failing to achieve the 95% is considered a class 3 defect. We are having boards with PIH gold plated leads rejected for not meeting this requirement. Part of the problem is making the determination as to where and how the 95% is measured. Can you clarify for us exactly where the 95% is measured on the lead. Before I reply to this engineer I thought to see if you had any input. Thanks, Dave --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------