Why should I participate in IPC technical seminars at National Electronics Week? To stay ahead of the curve! Make the most of your time at National Electronics Week. Stay up to date with in-depth technical seminars presented by IPC - Association Connecting Electronics Industries. Explore full course descriptions at www.ipc.org/IPCuk<http://www.ipc.org/IPCuk>. Technical seminars will take place in a compelling location: Earls Court, Warwick Road, London. Register now for technical seminars at www.ipc.org/IPCuk<http://www.ipc.org/IPCuk>. Take advantage of value pricing for this event: £175 for one full-day or two half-day seminars, £95 for one half-day seminar. Save 10% on registration with confirmation by 30 May 2008. Technical Seminar Program at a Glance Tuesday, 17 June Achieving High Reliability for Lead-Free Solder Joints - Material Considerations Ning-Cheng Lee, Ph.D., Indium Corporation of America Designing PCBs for Lowest Cost - Reducing Layers and Other DfM Principles Happy Holden, Mentor Graphics Surface Mount Technology: Principles & Practice in a Lead-Free World Ray Prasad, Ray Prasad Consultancy Group Updating Rework and Repair for Lead-Free Berry Morris, ART Advanced Rework Technology Lead-Free Reliability for Harsh Environment Electronics Jennie Hwang, Ph.D., H-Technologies Group Wednesday, 18 June Design for Reliability, Reliability Testing & Data Analysis, and Failure Analysis of Lead-Free Solder Joints John Lau, Ph.D., Institute of Microelectronics What is HDI? Do you Need HDI? How to Get Started Happy Holden, Mentor Graphics Lead-Free BGA Reliability in Packaging and Assembling Jennie Hwang, Ph.D., H-Technologies Group Ball Grid Array: Principles and Practice Ray Prasad, Ray Prasad Consultancy Group Thursday, 19 June Stencil Printing Process for Solder Paste Application: An In-Depth Look S. Manian Ramkumar, Ph.D., Rochester Institute of Technology Reliability Issues with Lead-Free Soldering Processes Werner Engelmaier, Engelmaier Associates L.C. True Design for Reliability: Understanding What Is and What Is Not DfR Craig Hillman, Ph.D., DfR Solutions Advanced Component Packages - An Introduction Including Lead-Free Implementation S. Manian Rumkumar, Ph.D., Rochester Institute of Technology Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (PTHs/PTVs) Including Lead-Free Soldering Impact Werner Engelmaier, Engelmaier Associates L.C. Understanding Failure and Root-Cause Analysis in Lead-Free Electronics Craig Hillman, Ph.D., DfR Solutions --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------