David: There are two known public sources of this information: 1. Got to the recent APEX/IPC proceedings and there is a paper by CALCE 2. If you are an SMTA member search on the site and download the U of Binghampton NY paper In both cases there was no changes in shear strength for reballed components (up to 5x). You do have to watch what the end use environment is and as a service provider we always caution people to qualify the reballed components based on risk factors and end use environment making sure to perform the proper QA testing. Regards Bob Wettermann BEST David Tremmel <[log in to unmask]> wrote: Hello, I am interested in reballing/rebumping BGAs and replacing the SAC305 solder spheres with 62/2/36 but would like to know if there is any reliability data or at least a white paper or study published on the subject. If there are no papers or studies available, would anyone venture an opinion on how will the extra silver (compared to 63/37) effect the solder joint? Will the extra silver help lessen cyclic creep-fatigue? Thank you in advance for your responses. Thank you, David Tremmel Value Recovery --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- Bob Wettermann PH 847-767-5745 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------