You're welcome. No. It is both surface mount and through-hole. But it has a number of modern SMT technologies. I will send you a picture of the board. Joe Russeau ----- Original Message ----- From: "Schaefer, Chris" <[log in to unmask]> To: <[log in to unmask]> Sent: Wednesday, April 30, 2008 3:26 PM Subject: Re: [TN] Hand Cleaning Chemistry Qualification Thanks Joe. I have yet to see is the B-52 board all surface mount? Chris Chris Schaefer Suntron Corporation Process Engineer 800 N. Brutscher Street Newberg, OR 97132 Work Phone: 503.554.6270 Cell Phone: 785.248.9016 Email: [log in to unmask] -----Original Message----- From: Joe Russeau [mailto:[log in to unmask]] Sent: Wednesday, April 30, 2008 11:09 AM To: TechNet E-Mail Forum; Schaefer, Chris Subject: Re: [TN] Hand Cleaning Chemistry Qualification Hi Chris, Perhaps, I'm reading your post incorrectly, but it comes across (at least to me) that you are wanting to know what changes you should make to your process in order to get the best result from the cleaner. Really, you should be focused on whether the cleaner removes the soils left by your process. If it doesn't, then perhaps it's not the right cleaner. As for methods, you indicate three techniques that will be of value for evaluating the cleaner and any residual process residues / chemical interactions. Here are a few quick suggestions (take em for what they are worth): 1) Select a test vehicle for SIR and/or ECM that closely matches your assembly technology. A functional assembly will not work for this type of testing. The IPC-B-52 would be one good choice. It also has breakaway coupons for IC testing. Two drawbacks; 1) it is a little expensive and 2) it does not have an extensive data history. Doug Pauls designed the B-52 and will likely comment. The IC portion of your testing could also be done on functional product. 2) Process the boards as you would normally do. The cleaner needs to prove that it can remove your assembly and fabrication residues and not leave harmful materials behind. If you have several processes and materials, choose one that is representative of most of your product or one that represents a worse-case scenario. 3) If you are doing any conformal coating, then it may be advisable to also to include thermal shock, just to verify that adhesion and coating properties do not change as a result of this new cleaner. 4) Visual inspections should be done. 5) I would also suggest doing a comparative study to your current material. This will allow you to evaluate how the new stuff compares with the stuff your replacing. 6) If you use ROSE testing to monitor the process on a regular basis, it would be a very good idea to include this as part of your test matrix. I would suggest processing enough samples to do ROSE testing (use your own tester), along with the IC, SIR and or ECM. This will help you establish a baseline for your ROSE tester while qualifying the new cleaner at the same time. 7) Always, always, always, send samples of the unprocessed boards and components to act as controls. If I had a nickel for every test I've seen where the customer doesn't include the unprocessed boards, I'm sure I could almost pay off my diet Mt. Dew tab to Doug. Anyway, just a few thoughts to help get the ball rolling. I'm sure others will comment and make suggestions. Best Regards, Joe Russeau Precision Analytical Laboratory, Inc. ----- Original Message ----- From: "Chris Schaefer" <[log in to unmask]> To: <[log in to unmask]> Sent: Wednesday, April 30, 2008 12:58 PM Subject: [TN] Hand Cleaning Chemistry Qualification TechTeam, We are in the very beginning stages of starting a conversion from one hand cleaning solvent to another more effective one. I am curious what makes the most sense in terms of methods to use to qualify as well as what is the likely norm from the industry? We are required to perform SIR or ECM, and IC testing by various customers prior to any changes which I think is a good thing, but what would be the application process of flux, soldering, and finally cleaning? As well as the actual soldering and cleaning process. With the various geometries, spacing, ground planes, thermal requirements, materials, time, etc... How would best capture the effectiveness of the new solvent? We are currently using an RMA 15% solid flux, hand soldering with 600-700dgree tips on multi-layer product from FR4 to teflon. I hope I didn't open a huge can-o- worms. Thanks all and have a great day! Chris --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------