John, Not being a board designer, what is the recommended pad size and geometry for a ceramic 0805? Thanks, KennyB -----Original Message----- From: John Maxwell [mailto:[log in to unmask]] Sent: Monday, April 28, 2008 3:04 PM To: TechNet E-Mail Forum; Ken Bloomquist Subject: Re: [TN] Cracking Ceramic Cap Ken, Boy this take me back to my capacitor cracking days. It will be nice to see what the failures look like but from what has been described is consistent with assembly flexure cracking. When I wrote my first paper on MLCC crack signatures the great majority of cracks were due to assembly handling followed closely be excessive solder joint size. Things have not changed in the intervening 20+ years. Big wide solder joints and a connector right next door, the perfect recipe for cracks. John Maxwell --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------