John,

Not being a board designer, what is the recommended pad size and geometry
for a ceramic 0805?

Thanks,

KennyB

-----Original Message-----
From: John Maxwell [mailto:[log in to unmask]] 
Sent: Monday, April 28, 2008 3:04 PM
To: TechNet E-Mail Forum; Ken Bloomquist
Subject: Re: [TN] Cracking Ceramic Cap

Ken,
Boy this take me back to my capacitor cracking days. It will be nice to 
see what the failures look like but from what has been described is 
consistent with assembly flexure cracking. When I wrote my first paper 
on MLCC crack signatures the great majority of cracks were due to 
assembly handling followed closely be excessive solder joint size. 
Things have not changed in the intervening 20+ years. Big wide solder 
joints and a connector right next door, the perfect recipe for cracks.

John Maxwell



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