Hi Wayne! Your logic is right on the money! The JSTD-001 & IPC-610 committees have allowed solder to touch the bodies for other plastic devices (see JSTD-001, section 7.6.7) for the reasons you listed. It is pretty much impossible to not have the corner of a plastic bodied SOIC touch the solder fillet (lots of physics working against us). Jack Crawford is very diligent about watching our TechNet discussions about JSTD-001 and 610 topics so I'll trust he'll bring this discussion to the committees attention. Dave Hillman Rockwell Collins [log in to unmask] "Thayer, Wayne" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 04/16/2008 09:00 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Thayer, Wayne" <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Inward formed L-shaped ribbon lead - solder I believe the intent of the specification is to make sure that there is enough flexibility in the attachment structure to make up for planar TCE issues between the part and the board it is mounted on. As the pictured fillet does not interfere with that, it should be a pass. That is just my opinion, using logic. Perhaps someone responsible for the standard could address this. Wayne Thayer -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Wednesday, April 16, 2008 9:51 AM To: [log in to unmask] Subject: Re: [TN] Inward formed L-shaped ribbon lead - solder Well, I asked the instructor here, and he said that according to the -610 it is a defect. But then he added that you'll more than likely have that if you are coming anywhere close to the maximum fillet height and that defect is something that you'll probably never be able to see unless you do a cross section like you did. Just from my perspective; I've never worried about it and don't think that I've ever built a board that ever had a problem that was attributable to excess solder on the inside bend. I'm sure I've built boards that had solder there. I've waved boards that had bottomside SMT L-shaped ribbon leaded components and again, I don't see how you would be able to keep the solder from wicking there. Jack, do you have your ears up? Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Wednesday, April 16, 2008 7:48 AM To: [log in to unmask] Subject: Re: [TN] Inward formed L-shaped ribbon lead - solder Good Morning Jan! I have your photos posted. They're at: http://stevezeva.homestead.com/files/tantal01.jpg and: http://stevezeva.homestead.com/files/tantal02.jpg In my opinion it's not a defect. I don't know how you would prevent the solder from wicking there during reflow...but that's just my opinion. In fact what I'll do is ask an IPC Master Instructor that we have here certifying some people here for -610 instructors and see what he says. Kind regards, Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lamote, Jan Sent: Tuesday, April 15, 2008 11:16 AM To: [log in to unmask] Subject: [TN] Inward formed L-shaped ribbon lead - solder Technet, During cross section analysis we came across the section of a tantalum capacitor. The soldering was flagged as non conform IPC-A 610D. In section 8.2.11 Inward Formed L-Shaped Ribbon Leads, table 8-11 indicates for class 1, 2 and 3 states for the maximum fillet height :"Solder does not contact the component body on the inside of the lead bend." If you now have a contact between the bottom corner of the component body and the solder, is this a defect ? (have some pictures if needed, don't know if there still is a "technet image upload service") After asking different people I got answers ranging from "reliability hazard" to "common with these types of components and acceptable" (including independent lab, EMS, IPC training organisation...) If something is a defect in all classes, seems to me that there must be good reason why it is unwanted. If it is common and acceptable, then I would expect to see it listed as such in the standard. Can anyone explain how this rule needs to be interpreted and what the real dangers are ? thanks, Jan. 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