Timmy,
There is no international standard to define the solder paste thickness which is guarded by the stencil thickness, printing force, contact printing or snap off, and the release characteristic of particular paste. For the small aperture, the area ratio of stencil aperture play the important part to decide the stencil thickness used ( you can refer to -IPC 7525). For your case, the aperture is large so the the release ratio is not important. However, if printing the solder paste on the whole pad, there may product the void problem and solder ball issue. Typically, a series of small apertures are used to reduce the void and total amt of solder paste deposited
Jackson chan
Technivcal services manager
Cookson electronics - alpha metals
SACX0307 - low cost lead free
----- Original Message -----
From: TGAsia [[log in to unmask]]
Sent: 03/25/2008 15:16
To: [log in to unmask]
Subject: [TGA] thickness of solder paste vs compontents soldering area
Dear, all,
Do you know if there is a standard
to define the thickness of solder paste according to the component soldering
area, the soldering area is
Thanks!
Best Regards
Timmy Ni
Information in this email and any attachments is confidential and intended solely for the use of the individual(s) to whom it is addressed or otherwise directed. Please note that any views or opinions presented in this email are solely those of the author and do not necessarily represent those of the Company. Finally, the recipient should check this email and any attachments for the presence of viruses. The Company accepts no liability for any damage caused by any virus transmitted by this email. All SGS services are rendered in accordance with the applicable SGS conditions of service available on request and accessible at http://www.sgs.com/terms_and_conditions.htm |