有关这个问题,需要弄清楚以下问题才能分析:
1. 引线基材/涂层是什么? 印制板过孔的涂层是什么?
2.裂开的详细位置在什么地方?  是引线与过孔裂开,还是其他地方?
3. 波峰焊的温度设置的Tg与TAL是多少?  波峰焊接的材料与助焊剂是什么?
4.造成失效的这种问题中在生产过程中出现的,还是客户使用之后出现的>概率是多少?
 
 
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----- Original Message -----
From: [log in to unmask] href="mailto:[log in to unmask]">WTSZ-Anny Zhou
To: [log in to unmask] href="mailto:[log in to unmask]">[log in to unmask]
Sent: Tuesday, March 11, 2008 1:17 PM
Subject: [TGA] 转发: Discrepant Material Report #IRR-08 0088 Requires Disposition.

Dear All

  有谁帮我看看附件上的几幅图片,什么情况下可能会造成如此锡裂?谢谢!

 

 


发件人: WTSZ-WenLi Mao
发送时间: Tuesday, March 11, 2008 12:22 PM
收件人: WTSZ-Anny Zhou
主题: 转发: Discrepant Material Report #IRR-080088 Requires Disposition.

 

 FYI




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