Thanks Guy, Positive word in this world of lead free mourning. I'm doing a little study so we can meet changes or problems asap. Except for you, seems as few have any problems or plan to improve or change things. Well, then my job will be simple... /Inge PS. Will send some stuff offline to you later. -----Ursprungligt meddelande----- Från: TechNet [mailto:[log in to unmask]] För Guy Ramsey Skickat: den 5 mars 2008 14:24 Till: [log in to unmask] Ämne: Re: [TN] Leadfree trends We do not see a significant difference in DPMO on Pb-Free vs. SnPb builds, when the designs are similar. We do see increased problems with plastics and epoxy, poor survivability in high aspect ration PTH, reduced success rates with board rework / repair and increased assembly cost and reduced through-put due to increased requirements to mitigate moisture sensitivity. One positive thing, we have much better results from pin-in-paste. The higher surface tension seems to work for us in this application. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Tuesday, March 04, 2008 1:19 PM To: [log in to unmask] Subject: Re: [TN] Leadfree trends Hi Inge! Here's your chart: http://stevezeva.homestead.com/files/Defect_Spectrum.jpg >From my experience, it's not that bad. Have had a few more tombstones with LF than I've seen in a long time, and a little more opens due to not wetting as well. But I can't say that I've seen more of the other three defects.... Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord Sent: Tuesday, March 04, 2008 10:45 AM To: [log in to unmask] Subject: [TN] Leadfree trends First, I would like to present a table from Agilent 2006 on the failure rate difference between leaded and leadfree soldering (with some help from Steve Gregory). Is it still that bad? Wait for link. Then, I would like to know if someone got reliable and independent and SHORT information on trends the nearest five years for SAC305 and SAC100 and others about: Voiding Tombstoning Insufficient barrel fill Bridging Tin whiskers Compound changes (like silver content, rheology etc) Solder temperature Component finish Selected board material and finish I suppose Mike Fenner has, but he may be not quite 'independent' (no,Mike, not your partnership, but from your profession ) /Inge --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------