IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead-Free Electronics Technical Conference - March 11, 2008 Educational Courses - March 12, 2008 Raleigh, N.C. There's still time to register! IPC and JEDEC are pleased to present the International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, March 11-12, 2008, in Raleigh, North Carolina. This conference will address the issues faced as a result of implementing a lead-free process such as alloy choices, component compatibility and solder concerns. The conference will have representatives from Trace Laboratories, CRANE, Intel, OK International, IHS International, Foresite, Inc., BEST, STI Electronics, Nihon Superior and many more sharing their company's experiences. Courses will be held on March 12, including topics such as rework for dummies a hands-on experience, lead-free solder joint reliability, interconnect failure and design for reliability, and reliability issues with lead-free soldering. For more information or to register, please cut and paste www.ipc.org/RRR0308 into your browser or contact Alexandra Curtis +1 847-597-2877 or e-mail [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------