He saying they want to stop performing the ENIG and perform full body and selective gold plate. Each of these would be 'pattern plating' and thus end the need for a tie bar.

You only need tie bars when you perform tab like plating, not selective or full body pattern plate.

Franklin

-----Original Message-----
>From: Ryan Grant <[log in to unmask]>
>Sent: Mar 28, 2008 2:26 PM
>To: [log in to unmask]
>Subject: Re: [TN] Gold Flash vs. ENIG Solder finish
>
>???? The explanation doesn't make sense.  ENIG does not need the tie
>bars removed and the tie bars must be removed after hard Au plating
>regardless of any surface finish. 
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Lefebvre
>Sent: Thursday, March 27, 2008 10:02 AM
>To: [log in to unmask]
>Subject: [TN] Gold Flash vs. ENIG Solder finish
>
>I have a FAB house that is recommending we switch from using ENIG for
>the main body with electroplated hard gold for the edge fingers to an
>alternate finish.  They are recommending Gold Flash *Finish the entire
>board with 3-10 micro inches of hard Au over 100-200 micro-inches of Ni
>and selectively Au plate fingers with 30-50 micro-inches of hard Au.
>They reason they want us to change is it removes the step of removing
>the tie-bars on the gold edge fingers.
> 
>Would this have an affect with solderability switching to Gold Flash?
> 
> 
>Scott 
> 
>
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