Maybe I missed something. I would expect Werner, Maybe I missed something. I would expect that if one looked at the BGA ball side of a fracture you would see something completely different from the 35-50%Ni, 20%Sn, and a couple of percent Pb that they indicated. I think that some of the fractures might have occurred at the solder ball / BGA package interface and that they were looking at the package side of those fractures rather than the ball side of a fracture at the PCBA. Regards, George George M. Wenger Andrew Wireless Solutions Senior Principal FMA / Reliability Engineer 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [Office] (732) 309-8964 [Cell] [log in to unmask] ________________________________ From: [log in to unmask] [mailto:[log in to unmask]] Sent: Wednesday, March 19, 2008 4:50 PM To: Wenger, George M.; [log in to unmask] Subject: Re: [TN] Case of the popping BGAs Hi George, The ball-side fracture surfaces were measured and described. Werner ************** Create a Home Theater Like the Pros. Watch the video on AOL Home. (http://home.aol.com/diy/home-improvement-eric-stromer?video=15?ncid=aol hom00030000000001) ------------------------------------------------------------------------------------------------ This message is for the designated recipient only and may contain privileged, proprietary, or otherwise private information. If you have received it in error, please notify the sender immediately and delete the original. Any unauthorized use of this email is prohibited. ------------------------------------------------------------------------------------------------ [mf2] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------