Sorry about the typo. IPC-TM-650, not TN. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Tuesday, March 18, 2008 12:30 PM To: [log in to unmask] Subject: Re: [TN] Solder Mask Defined Pad BGA Reliability There are copper peel strength tests/criteria documented in the IPC specs and especially in IPC-TN-650, but I do not know just how effective they are. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards Sent: Tuesday, March 18, 2008 12:19 PM To: [log in to unmask] Subject: Re: [TN] Solder Mask Defined Pad BGA Reliability Graham, I'm getting in this a little late but this is my 2 cents... We sometimes have problems with SMD pads because the PCBs we get seem to have an organic or foreign material on them after they are processed... This generates weaker bonds which fail at lower stresses...They can literally pop off the PCB... Do any of the PCB fabricators have a way of guaranteeing that SM residues are 100% removed from the pad surfaces? Paul -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kirk, Graham (GE EntSol, Intelligent Platforms) Sent: Tuesday, March 18, 2008 3:18 AM To: [log in to unmask] Subject: [TN] Solder Mask Defined Pad BGA Reliability Hi All, Can anybody tell me what the actual mechanism is that propagates cracks in the device to ball joint on plastic BGA's (Leaded balls) with SMD pads under thermal cycling? Graham Kirk Senior Technologist GE Fanuc Intelligent Platforms Ltd --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ======================================================================== ====== This email and any attachments thereto may contain private, confidential, and privileged material for the sole use of the intended recipient. 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