March 8, 2008

Does anyone have test data that shows the degree of oxidation that may occur 
on pure-tin (<3% Pb) plated copper or other base metal component leads, when 
the components are subjected to electrical burn-in testing for 96 hours at 
125C, 150C, 175C (similar to the MIL-PRF-19500, Appendix E screening test)?  
What is a safe temperature for electrical screening testing that will not 
cause the components to fail J-STD solderability test?

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