Hello TechNet Gurus, If there any of you out there that have to do BGA or large QFP rework on Class 2 assemblies at lead free temperatures, what general rule do you follow to bake the moisture out of the board? Even if the component has an MSL of 2a, 2 or 1, that does not mean that the PCB does not have an equivalent MSL so to speak. I generally shoot for 8 hours at 105°C but sometimes in a pinch will shorten it to 4 hours at 105°C for a standard 1.0 mm (or so) PCB. I am sure that 'it depends' will come up but I was wondering if I should consider the board itself as a 'BGA' with an MSL of 2a or 2. If anyone would like to share their experience, I thank you in advance. Thank you, David Tremmel 847 858-5540 - Cell 847 557-9574 - Office 847 557-9573 - Fax --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------