I am not allowed to tell you what my clients use, but I can tell you
that you should qualify your process by performing a thorough evaluation
of different chipbonders to determine which is best for your particular
application. There are many different chipbonders that are used for
different applications, for example you may need a low-outgassing
product for space hardware, or you may only need a chipbonder to hold
components in place during a double sided reflow process, but you do not
necessarily need the additional strength of a high-adherance,
low-compliancy underfill product. Some chipbonders, such as Loctite
3609, expand somewhat during curing. Others shrink. You will need to
determine what is best for your product. What works well for one
application could well be a disaster for another.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Tuesday, February 12, 2008 7:13 AM
To: [log in to unmask]
Subject: [TN] Glue Dots

TechNetters,

Is anyone using glue dots (to hold components in place during reflow, or
wave solder, for example) on a military product?
What material are you using, and what did you do to validate it?

Ben

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