I am not allowed to tell you what my clients use, but I can tell you that you should qualify your process by performing a thorough evaluation of different chipbonders to determine which is best for your particular application. There are many different chipbonders that are used for different applications, for example you may need a low-outgassing product for space hardware, or you may only need a chipbonder to hold components in place during a double sided reflow process, but you do not necessarily need the additional strength of a high-adherance, low-compliancy underfill product. Some chipbonders, such as Loctite 3609, expand somewhat during curing. Others shrink. You will need to determine what is best for your product. What works well for one application could well be a disaster for another. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben Sent: Tuesday, February 12, 2008 7:13 AM To: [log in to unmask] Subject: [TN] Glue Dots TechNetters, Is anyone using glue dots (to hold components in place during reflow, or wave solder, for example) on a military product? What material are you using, and what did you do to validate it? Ben --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------