Then I got you wrong, you are not talking about single pin insertion but connector press in... ________________________________________________ Delphi Deutschland GmbH Controls&Security Manufacturing Engineering Design Albert Einstein Straße 5 D-51674 Wiehl-Bomig Tel.: +49 (0)2261-971-880 Fax: +49 (0)2261-972-880 Mobile: +49 (0)151-18223504 E-mail: [log in to unmask] Rechnungsadresse: Delphi Deutschland GmbH Delphiplatz 1 D-42119 Wuppertal Sitz der Gesellschaft: Wuppertal Registergericht AG Wuppertal HRB 2254 Geschäftsführung: Michael Gassen (Vorsitzender) Diedrich von Behr, Peter Gajewski, Bernd Wegescheide Aufsichtsrat: Dr. Rainer Hermeling (Vorsitzender) _________________________________________________________ -----Ursprüngliche Nachricht----- Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Hernefjord Ingemar Gesendet: Freitag, 29. Februar 2008 09:07 An: [log in to unmask] Betreff: Re: [TN] AW: [TN] SV: [TN] SV: [TN] Do it yourself Occam assembly No, we use a semiautomatic machine from ERNI/Germany. Inge -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Neifer, Gebhard Sent: den 29 februari 2008 07:48 To: [log in to unmask] Subject: [TN] AW: [TN] SV: [TN] SV: [TN] Do it yourself Occam assembly Inge, can you please share which insertion machine you are referring to? I am aware of the Eberhard and Tyco/AMP systems that are quite fast. Have you bought one of these lately or is there another player I look into? Thanks in advance, cheers, Gebhard _________________________________________________________ -----Ursprüngliche Nachricht----- Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Hfjord Gesendet: Donnerstag, 28. Februar 2008 19:30 An: [log in to unmask] Betreff: [TN] SV: [TN] SV: [TN] Do it yourself Occam assembly Joe, I'm surprised, that nobody added a solderless technology that is widespread and used already. PRESSFIT !!! We have bought a machine that Inserts 600 pin connectors in just seconds. I'm in a group that makes some studies in future assembly technologies. We predict, that there will come some sort of platforms very like BGAs, but with pressfit instead of solder balls. Furthermore, we expect there will also come a micropressfit technology for semi packages, inductors, caps, potentiometers etc. The disadvantage with a all-pressfit board will be the assembly speed. A Ericsson mobile telephone board is typically chip shooter mounted in 30 seconds and soldered in a couple of minutes. Pressfit will probably never be that fast... Inge -----Ursprungligt meddelande----- Från: TechNet [mailto:[log in to unmask]] För Joe Fjelstad Skickat: den 26 februari 2008 23:04 Till: [log in to unmask] Ämne: Re: [TN] SV: [TN] Do it yourself Occam assembly Thanks Inge Yours is exactly the kind of thinking that is required to get us beyond the problems our poor beleaguered industry faces. All of what you list are certainly candidates for inclusion in a future world of solderless assembly. I trust that you have sparked some new thinking here as well. Best regards and wishes, Joe -----Original Message----- From: Hfjord <[log in to unmask]> To: 'TechNet E-Mail Forum' <[log in to unmask]>; [log in to unmask] Sent: Tue, 26 Feb 2008 11:59 am Subject: SV: [TN] Do it yourself Occam assembly Joe, you should change name to Joy ! And found the company 'JoyToys', if not lready established. Right you are anish will soldering ome will else Yoda) But I don't think all soldering will be superseded by alternative methods. Solderfree connecting has indeed existed for decades: Thickfilm hybrids with conductive adhesives, as you pointed out. Trillions of semi chips have been scrubbed to the header. YAG laser spot welded components Vacuum metal deposition Plasma metallization Plating technologies Chemical metal joining Electron beam spot welding Beamlead welding Amalgam technologies Electric discharge welding Friction welding Wire bonding Gold stud bumping Ultrasonic technologies Etc. Who knows, maybe one of these technologies will be developed for mass roduction of boards, or rather something that reminds of today's boards. /Inge -----Ursprungligt meddelande----- rån: TechNet [mailto:[log in to unmask]] För Joe Fjelstad kickat: den 26 februari 2008 18:49 ill: [log in to unmask] mne: [TN] Do it yourself Occam assembly Greetings folks, have tried to sidestep most of the controversy associated with Occam and solderless assembly as much as possible to focus on getting projects done. However some controversy is, I suppose, good as it keeps interest alive. As Yogi Berra might have noted: "If it wasn't controversial, everybody would ot top to avoid talking about it"... ;-) o I thought it might be worth while to give everyone here a way to make heir own Occam type assemblies using legacy through hole components at heir esk in a matter of minutes. This will allow folks to form their own pinions s to the fundamental viability of the concept for the future. his is only for demonstration purposes but I trust it will open some inds o the possibilities that exist in the fundamental concept. The following ill work for one or more metal layers but designs should be kept simple or ractical reasons. ) Obtain a piece of corregated cardboard box (Option: draw your ircuit ayout on the surface) ) Tape a piece of clear polyethylene (a half a common sandwich bag will o) to the cardboard ) Place a second larger piece of card board underneath to keep the desk or other surface clean ) Clip the leads down slightly (one can intuit for themselves how much o clip off) ) Push the leads through the polyethylene into the card board at (the olyethylene should seal the leads reasonably well but there might be some mall leakage to the card board) Pin holes might be required as starters or many eaded devices. Shorter clipped leads will be easier. ) Cut a hole in another piece of cardboard that will encompass the omponents and provide a resin dam wrap polyethylene around the exposed dges this step is optional depending on size of the assemlby) ) Mix up some 5 minute epoxy and pour over components (try not to get oo many bubbles entrained) ) Remove the assembly and trim the leads as necessary ) Using a silver ink pen (available from some circuit equipment roviders) draw your interconnections between contacts 0) If cross overs are required, use some nail polish at the ntersection. It can be used for cover coating if desired. 1) Attach battery and go have some fun. :-) otes. 1) If you want to include connectors, have the mated portions in hem in case some wicking occurs. ) Small batteries (or screw top battery holders) can be embedded if esired. ) Dome switches are a low profile choice. ) A piece of 100 mil center "bread board" without plated through holes can be used in place of the cardboard for greater placement accuracy if that is of interest. ) The process will work for SMT devices as well but the devices need to be kept flat and a sanding step will likely be required to clean off resin rom ontact surfaces. ) The conductivity of silver ink is about 10% of copper so stay away from high power designs. (keep it simple) his is obviously not a production technology but it does provide a simple demonstration. I sent Steve Gregory a photo of a simple assembly for those nterested to view what such a simple assembly looks like and he has kindly consented to post it. Here is the link: ttp://stevezeva.homestead.com/files/Through_hole_Occam_prototype.jpg . t could also serve the needs of some hobbyists and could be a fun project or anyone having children interested in electronics. hile I appreciate the skepticism of those who question the potential of olderless assembly, including many long time friends whom I respect and old ear. I trust that there will be some increase in acceptance of the concept with the data that we are in the process of generating. t may well be that the final versions of Occam assemblies will not look ery much like today's assemblies. They could well appear to look more like metal jacketed bricks with interconnections on the surfaces to which other ssembly elements (keyboards, displays, etc.) can be joined using other olderless echniques such low profile connectors or conductive and/or anisotropic onductive adhesives. he brick like structure should also prove great for product design ecurity. Remember when Apple announced the I-Phone last year? 3 days ater there as a public tear down of the product design an everyone could see what was going on. It will be much more difficult with the solderless brick pproach. ortunately, wholesale change within the industry is not required for the rocess as identified. The equipment, materials and chemistry exist for very rocess required. More importantly, there are some new materials and rocesses on the horizon that appear extremely well suited to the olderless pproach. nother point that needs to be addressed related to the process nvironment. number of folks have registered alarm or at least concern at the thought f having plating equipment under the same roof as pick and place equipment (or vise versa). To allay such concerns, one need only go to just about any CB hop in the world to see precision equipment (drills, lasers and imaging quipment) under one roof with a plating shop. The process areas are hysically nd environmentally separated of course. The PCB industry has operated in uch a fashion since the 1960s. hanging topics, I found the following quote from a Test and Measurement orld article from October of last year. ttp://www.tmworld.com/article/CA6482921.html In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major tudy f solder-joint defects on printed-circuit boards (PCBs). The study, which t the time provided the most definitive data on the subject, involved 15 ompanies and more than 1 billion solder joints. Oresjo concluded that lthough ompanies claimed defect levels in the range of 75 to 150 defects per illion pportunities (DPMO), the reality was 5 to 10 times that high." n Oresjo's original study, he found the following defect distribution: ) 41% Solder Opens ) 20% Shorts ) 20% Solder Quality ) 8% Placement ) 8% Electrical ) 3% Other t appears that almost 80% of the problems are related to soldering (90% if the 8% for placement is included but I am sure it is much better these ays.) he 8% electrical problems cited are, I assume, parts related problems of nspecified cause. hile on the subject of electrical failures, does anyone here have any data on how many components are damaged by the temperatures associated with the soldering process? Also how many of the electrical failures might have been caused by poor cleaning? I have heard a lot of anecdotal information but no hard facts. I guess I am wondering, has there been an identified and easured ffect of the lead-free assembly on first pass product assembly yield ompared o tin-lead solder? would prefer an open forum answer to these questions but I realize that here might be some discomfort so if anyone prefers to respond off line, hat s fine. Thanks in advance for any input on the topic. est wishes to all and have some fun with the table top solderless ssembly... oe **************Ideas to please picky eaters. 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