Diffuse is even a better one. :-) ----- Original Message ----- From: TechNet <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Tue Feb 12 17:50:52 2008 Subject: Re: [TN] Through Hole Pad Solder Non-Wetting Migrate is a better word than leach, sorry. I've been thinking about fishing for walleyes too much. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Tuesday, February 12, 2008 4:45 PM To: [log in to unmask] Subject: Re: [TN] Through Hole Pad Solder Non-Wetting No, it is not. Standard ENIG is optimally 150 uinches of nickel, with between 3-6 uinches of gold over it, per the IPC spec. What Paymon has is not ENIG. Electroless Nickel Thickness APPENDIX 4 3.2.1 3 to 6 μm [118.1 to 236.2 μin] Immersion Gold Thickness APPENDIX 4 0 0.05 μm minimum [1.97 μin minimum] Paymon, if you in fact have only 1-3 uinches of nickel, you are really screwed. Even if you have 1-3 um of nickel, you are under the minimum of 3 um. This will cause the copper to leach through the nickel and react with the gold, and cause all kinds of solderability issues. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir Sent: Tuesday, February 12, 2008 2:41 PM To: [log in to unmask] Subject: Re: [TN] Through Hole Pad Solder Non-Wetting Sorry, I'm always confused with microinches and microns. :-( The thickness is fine. Vladimir -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani Sent: Tuesday, February 12, 2008 2:30 PM To: [log in to unmask] Subject: [TN] Through Hole Pad Solder Non-Wetting Hello All, We experienced solder non-wetting to a PCB through-hole component pad surface. The PCB surface finish is ENIG. The microsection results from the suspect PCBs show that the Nickel plating is thin from 1 to 3 micro-inches. We related the thin Nickel plating to Nickel corrosion and PCB surface non-wetting. However, the microsection also revealed copper corrosion at Copper to Nickel interface! I have never seen the copper corrosion in the past and I would like to ask if any of you has a similar experience in the past. What could be the cause of copper corrosion? I have few images if you are interested to see them. Regards, Paymon --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------