Well, it would kill the whole idea of having an almost table top ion mill dedicated to cross-sectionning. :-)
Vladimir
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Feb 20 19:18:39 2008
Subject: Re: [TN] Focused Ion Beam Milling for Cross Sectioning Solder balls .
FEI dual beam (focus ion beam + SEM) possibly will do the trick. I have
used it for cross section wire bonds, and look at the crystallography
structure and deformation under thermosonic bonding interface. Not
cheap, only quarter Mil to 0.75 Mil depend upon what you want to
do...;-). Reuven, do you have a deep pocket? It is a wonderful
machine... you can always find someone who has deep pocket and pay for
the service (not cheap either). Cross section just a piece of cake
(provide your sample is small enough, like a BGA device, not a full
populated circuit board.
http://www.fei.com/uploadedFiles/Documents/Content/MRS_Bulletin_2007_FIB
_machining.pdf
jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Wednesday, February 20, 2008 4:11 PM
To: [log in to unmask]
Subject: Re: [TN] Focused Ion Beam Milling for Cross Sectioning Solder
balls .
Hi Reuven,
I don't have the equipment details. They have a website
_www.oregon-physics.com_ (http://www.oregon-physics.com) which is a
bit sparse on information but
does have a contact link.
They are it appears a relatively new company so I expect that they would
be
quick to respond.
Best regards,
Joe
**************Ideas to please picky eaters. Watch video on AOL Living.
(http://living.aol.com/video/how-to-please-your-picky-eater/rachel-campo
s-duffy/
2050827?NCID=aolcmp00300000002598)
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