At the specified microinches of Au you are definitely outside the capabilities of the ENIG process. So your choices will be electroless gold (not immersion) or electrolytic gold. For bonding soft gold is the choice and not hard. 10 - 20 microinches will not create gold embrittlement in the solder joint, particularly if you are using hi temp SAC alloy for soldering. You will have to exceed 40 microinches for gold embrittlement. Regards George Milad George Milad National Accounts Manager for Technology Uyemura International Corp (UIC) 249 Town Line Rd Southington CT 06489 [log in to unmask] Cell: (516) 901 3874 **************The year's hottest artists on the red carpet at the Grammy Awards. Go to AOL Music. (http://music.aol.com/grammys?NCID=aolcmp00300000002565) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------