Thank you everyone for your responses to my question. I believe I have what I need. I should have been more specific in my request in that I was not looking for gap filling materials like Sil-Pad or the Berquist material, but more of a blanket material going over the top of components. Think Shrink Wrap over the top. Doug Pauls Olav Folland <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 02/05/2008 06:20 PM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Olav Folland <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Molded silicone thermal sheets Doug, If you don't have too much variation in component height, try Bergquist's Gap pad materials. They're available in sheet form and are pretty flexible. They also have several different hardnesses to pick from depending on your needs. We've used it with good success between PCBs and chassis for heatsinking devices. Olav Folland Galil Motion Control Douglas O. Pauls wrote: > OK, so it is late afternoon, I have sniffed too much toluene for one day > and the brain is not functioning like it should (leave it alone Dewey). > > I know in the past few months reading something about companies that will > make molded silicone overlays that go on top of electronic assemblies. The > silicone can be loaded with thermal conductive fillers, such that you have > a flexible heat sink that can be applied over a board surface. > > Do any of you know the company that produces such a beast? > > Doug Pauls > Rockwell Collins > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------