EMTF-07G

Geographic Strategies for Global Expansion in the Electronic Interconnect Industry: Where to Invest for Long-Term Business Growth - Single User License

This study was developed by BPA Consulting Ltd. on commission from IPC.  Its purpose is to provide a comprehensive guide to worldwide investment for growth-minded companies in the electronic interconnect industry.  It is an essential source of information and guidance for electronics industry executives in the process of long-range planning.  The report offers an analytic structure for comparison of both developed and developing economic regions and relates them to the specific needs of companies in the industry.  It identifies and compares the key economic, social, legislative, educational, logistic and technical factors that influence the way in which these regions are developing.  It also describes how key industry sectors are adopting and benefiting from the local characteristics of each region.  It identifies technological and market “hot spots” throughout the world for each industry sector and forecasts the development of industry capabilities and concentrations in the key regions.   Published December 2007.

 

EMTF-07M

Microelectronics: The Future of Miniaturization and its Impact on Electronics Manufacturing - Single License User

This study was developed by Prismark Partners on commission from IPC.  It covers the technology needs, challenges and opportunities that the trend toward miniaturization presents to all segments of the electronic interconnect industry.  It assesses the drivers of miniaturization and related end-product trends, as well as new and evolving technologies that miniaturization is driving, such as embedded components, high-density interconnect (HDI) and connector types.  The report explains where these technologies apply and where they are going.  New research conducted for this study focused on three major end-product industries – personal computers, hand-held electronics, and infrastructure equipment for the datacom/telecom industry – and addresses the leading OEMs’ technology roadmap requirements.  The study discusses the impact of miniaturization on the supply chain and how it will drive certain technology and business shifts.  It also offers a forecast of future technology needs and market opportunities for all segments of the interconnect industry.  Published December 2007.

 

Visit www.ipc.org/onlinestore or follow the live links above. Both of these documents are available in single user and global licenses.

 

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